SOLDERING PROCESS DEVICES

REFLOW CHECKER & FLOW PROFILER

Malcom offers you New Concept Measurement System of Reflow Oven & Flow Soldering.

TABLE TOP MODULE REFLOW OVEN/SIMULATOR

[Features]
● Dip Tester for Selective Wave Soldering is launched.
● Equipped with a New Dip Time Sensor, providing
more accurate measurement.
● Transfer data to a PC by USB, creating temperature
profile.
● Dedicated software realizes

Solder-Paste Tackiness Tester　Model: TK-1S

Compliant to JIS, IEC & IPC standard
[Features]
● Measure the adhesive strength of materials such as solder paste. Measurement items: Tackiness, Load and Insertion Depth
● There are three insertion methods, making it possible to measure under the conditions closer to the actual mounting manner.
● It is useful to feed back the difference of the tackiness obtained by changing the set conditions to the production site in a timely manner.

Flux Controller
Model: MS-9C

Automated control of Specific Gravity and Level of Flux.
[Features]
● Specific Gravity, Level, Temperature sensors, and Bob automatically control flux.
● 1/1000 digit display of Specific gravity and flux temperature are shown on the digital display.
● The exclusive features of MS-9C are 1/10000 digit display of Specific gravity, built-in Moisture compensation circuit (0% conversion) and RS-232C output connector

Oxygen Analyzer　Model: OAS-1

Measure wide range of O2 concentration in N2 atmosphere.
[Features]
● Requires no calibration work by reference gas before use.
● Equip communication output port (RS-232C) for PC connection as a standard feature.