SOLDER-PASTE TACKINESS TESTER(TK-１)
SOLDER-PASTE TACKINESS TESTER(TK-１S)
Compliant to JIS, IEC & ANSI standard
Prevent Component Dropping.
Tackness is quantitatively measured in three motions.
JIS/IEC/ANSI
Electronic Materials,Adhesive Materials
Features
- ● Measure the adhesive strength of materials such as solder paste. Measurement items: Tackiness, Load and Insertion Depth
- ● There are three insertion methods, making it possible to measure under the conditions closer to the actual mounting manner.
- ● It is useful to feed back the difference of the tackiness obtained by changing the set conditions to the production site in a timely manner.
product specification
| Item | Specification | |
| Model Name | TK-1S | |
| Load Sensor | Range | 0 - 400gf +/-2gf |
| Resolution | 0.25gf | |
| Measurement Methods | (1) Continuous preload, JIS (2) Insertion depth (3) Point preload, IPC | |
| Parameters Measured | (1) Tackiness : T gf (2) Real Preload : P gf (3) Real Insert depth : D μm | |
| Preset Ranges | (1) Preload : -20 - -400gf
(2) Time : 0.1 - 99.9s (3) Speed : 1.0 - 10.0mm/s (Continuous preload / Insertion depth) 2.0 - 600.0mm/min (Point preload) (4) Depth : 20 - 200μm * (5) Temperature : Room temp. +10C - 250C |
|
| Accessories | ● Hand printer with 0.2 mm mask ● Test piece, 5.1 -mm dia. probe | |
| Outputs | Digital | RS232C |
| Weight | Approx. 10kg | |
- * In the testing method with continuous loading insertion speed is setting value until Retraction speed 120mm/min.
and over 120mm/min, insertion speed is 120mm/min. - * The above specifications are subject to change without notice.
