Compliant to JIS, ISO, IEC, IPC & MIL standard
[Features]
● Automate the process of from flux application to end of measurement,
providing reduction of the variation caused by operator skill.
● Automate the process of from flux application to end of measurement,
providing reduction of the variation caused by operator skill.
● 0402 size and etc. of Micro components are also available.
(Optional Chip Placement System is necessary.)
● Change Solder and Flux with ease.
● Dedicated software analyzes data on a PC screen. (option)
Wetting Balance Measuring Method

Compliant to JIS & IEC standard
[Features]
● The SP-2 is an optimum device to evaluate wettability of lead free solder.
(Solder paste, Component, & Temperature conditions)
● Observe all wetting processes from glass windows.
● Wetting Balance Measuring Method, Micro Wetting Balance Measuring Method,
and Quick Heating Method are possible. (option)
● Simulate the temperature profile, the same as the actual reflow process or
the optimal profile. (Pre-heat function and powerful heater are built-in.)
● The wettability evaluation of micro chip components, such as 1005 or 1603 size,
is possible. (Electro-balance sensor detects minuter components.)
● Dedicated software automatically analyzes test results of wetting time,
wetting force and etc.