SOLDER-PASTE WETTING TESTER
（SP-2）
SP-2 is wettability testing machine for solder paste, parts electrode and PC board, adopted SP-Tension-Method （Temperature Profile Method)
Three measurement methods
Observation the process of wetting
Feature
- ●Can test and evaluate solder paste, PC board and parts-lead.
- ●All wetting process can be observed from glass windows.
- ●"Wetting Balance Measuring Method","Micro-Wetting Balance Measuring Method", and "Quick Heating Method"
are possible optionally. - ●Can simulate reflow oven profile with hot air and N2 purge.
- ●Electro-balance sensor adopted allows detection of very small force.The wettability of microchips can now be
examined by this unit. - ●Analyze wetting time and force with exclusive software.
- ●Solder wire testing is also available.
product specification
| Item | Specifications | |
| Load Sensor | Principle | Electro - balance sensor |
| Measurement range | 10.00gf～－5.00gf | |
| Measurement accuracy * | ± (10mgf + 1 digit) | |
| Resolution | Less than 900 mgf: 0.001 gf More than 900 mgf: 0.005 gf | |
| Temp. Sensor | Measurement range | 0～300℃ |
| Measurement accuracy | ±3℃ | |
| Heater unit | Temp. of heater unit | Room temperature ～ 300℃ |
| O2 Concentration | Simple closed heater unit with nipple for N2 purge test | |
| Temp. profile setting |
1. Preheat temp. 2. Preheat time 3. The rate of temp. rise 3℃ /sec. (standard) 4. Maximum temp. 5. Maximum temp. time |
|
| Melting point | Preset solder paste melting point | |
| Table movement |
Automatic: operated by PC Manual: operated by Up/Down switch (selectable 3 steps speed) |
|
| Digital output | RS-232C cable (Malcom format) | |
| Air supply |
Original air pressure: 0.2～0.5 Mpa (Approx. 2～5 kgf / cm2) Adjustment air: 0.2 Mpa (Approx. 2kgf / cm2 ) |
|
| Power supply | AC100V 50 / 60Hz 700W | |
| Weight | Approx. 20kg | |
- *Load sensor accuracy is not concerned oscillation.
