SOLDER-PASTE PRINT INSPECTION SYSTEM(TD-4M)

Inspection system for measuring paste area and volume easily.

●Minimum functions and high cost performance.
●Measure the height of solder paste using slit laser. * A Colored CCD camera makes it possible for clear
image inspection.
●Coordinates-Display-Function allows you to move PCB to the inspection position that you desire easily.
●Save data in USB memory.
●SPC data analysis of the automated measurement data. (optional)

Item		Specification
Model Name		TD-4M
PC Board clamp table		Circuit board gripping allowance 3mm, both-side clamping is possible
Outer Dimension		420(W) x 635(D) x 350(H) mm
System		High-speed image processing computer system built in
Weight		22kg
Power Supply		AC100 - 240V, 50-60Hz, 140W (Service AC outlet not included)
Interface		USB for printer
		USB for flash memory
		Keyboard Input
		Mouse Input
		Monitor Output

Item		Specification
Inspection	Object	Thickness of printed solder paste
	PCB Warpage Range	±1.5mm
	Measurement Range	2mm(W), 3mm(D), 50 - 350μm(H)
	Resolution	8μm
	dgment function	Automatic OK/NG judgment
	Standard Position Setting	Taking in PCB display image (One point)
	Speed	1 second or less / visual field (Standard)
	Data	Input method : Teaching, number of data : 150 fields
	Output	Output to printer and in text files
	PCB Dimension	Outside: 50 x 50mm min., 250 x 330mm max. Thickness: 0.5 - 2.0 mm
	Measurable range	240×320mm
Optical Section	Light Source	660nm semi-conductor laser
	Camera	1/4-inch color CCD
	Camera Field	4mm×3mm
	Measuring Principle	Optical cutting triangular surveying by laser slit light, irradiation angle 45deg.
	Cut slit	20μm x 10mm
	Safety Classification	Classification acc. to laser danger level: Class 2