COMPACT REFLOW OVEN(RDT-165CP)
Compact reflow oven for Cell-based production. Low power consumption provides excellent cost-performance benefits.
High Δt performance
For 165 x 200mm substrates
Feature
- ●Up to 10 profiles can be saved and uploaded (via special software & USB conncetion) to memory.
- ●Up to 10 heating stages can be set-up to create your desired temperature profile.
- ●When using multiple units, an intelligent function prevents the units from simultaneously consuming peaks of power
at the same time. - ●Its low price and compact size allow the RDT-165CP to be efficiently utilized in many workspaces.
- ●Adjustments can be made quickly and smoothly with its relatively easy interface.
product specification
Item | Specification | |
Model Name | RDT-165CP-A | RDT-165CP-N |
Applicable Circuit Board | Up to 200W x 165L x 20H (Upper) 15H mm (Lower) mm | |
Outer Dimension | 460(W)×735(D)×1067(H)(mm) (Main Unit) 1327H(mm) (w/signal tower) | |
Heating Method | Upper-face : Extreme infrared radiation with hot air
Lower-face : Extreme infrared radiation |
|
Cooling Method | Underside cooling fan | |
Power Supply | 200V 50/60Hz 7kVA 3Phase | |
Air | by flowing air (with flow adjustable valve) 0.3 - 0.5MPa 100 liter/min (Maximum) | by flowing N2 air (with flow adjustable valve) 0.4 - 0.6MPa 100 liter/min (Maximum) |
PCB Installation | Net system or Carrier system (Selectable on request) | |
Upper-Heater | xtreme infrared radiation with hot air heater : 4.8kW
(Approx.400W x 12 block) * Adjustments can be made using the Matrix Heating System |
|
Lower-Heater | Extreme infrared radiation heater : Approx. 1kW (500W x 2) | |
Temp. Range | Room temp. - 330C | |
Control | Exclusive softwarefor Windows 7/8.1/10 | |
Weight | Approx. 85kg |
- * The above specifications are subject to change without notice.